Iipropati zeMveliso
UHLOBO | CHAZA |
udidi | ISekethe eDityanisiweyo (IC) Ifakwe - Microcontrollers |
umenzi | Inkampani NXP USA INC. |
uthotho | MPC56xx Qorivva |
Iphakheji | itreyi |
ubume bemveliso | ikhona evenkileni |
iprosesa engundoqo | e200z4 |
Ukucaciswa kweKernel | 32-bit core ezimbini |
isantya | 80MHz |
Uqhagamshelwano | CANbus, FlexRay, LINbus, SPI, UART/USART |
Iiperipherals | DMA, POR, PWM, WDT |
Inkqubo yokugcina umthamo | 1MB (1M x 8) |
Uhlobo lwememori yenkqubo | flash |
EEPROM umthamo | - |
Ubungakanani be-RAM | 128K x 8 |
IVoltage-Ubonelelo lwaMandla (Vcc/Vdd) | 3V ~ 5.5V |
isiguquli sedatha | A/D 32x12b |
Uhlobo lweOscillator | ngaphakathi |
Ubushushu bokusebenza | -40°C ~ 125°C (TA) |
uhlobo lofakelo | Uhlobo lweNtaba yoMphezulu |
Ipakethe/Indawo ebiyelweyo | 144-LQFP |
Supplier Device Packaging | 144-LQFP (20×20) |
Inombolo yemveliso esisiseko | SPC5643 |
Amaxwebhu kunye neMidiya
UHLOBO LWEZIBONELELO | LINK |
Ulwazi lokusingqongileyo | NXP USA Inc REACH211 Cert NXP USA Inc RoHS3 Cert |
iveliso ezifakiwe | Umatshini wokuthengisa amatikiti |
Uyilo lwePCN/Inkcazo | I-Mult Dev DS Chg 11/Feb/2022 |
Iphakheji yePCN | Lonke uHlaziyo lweLeyibhile yeDev nge-15/Dec/2020 IMult Dev Pkg Seal nge-15/Dec/2020 |
Ulwahlulo lokusiNgqongileyo kunye noThunyelo ngaphandle
IIMPAWU | CHAZA |
Ubume beRoHS | Iyahambelana neenkcukacha ze-ROHS3 |
iNqanaba lokuSenza ukufuma (MSL) | 3 (168 iiyure) |
FIKA ubume | Iimveliso ezinga-REACH |
ECCN | 3A991A2 |
HTSUS | 8542.31.0001 |