Iipropati zeMveliso
| UHLOBO | CHAZA |
| udidi | ISekethe eDityanisiweyo (IC) Ifakwe - Microcontrollers |
| umenzi | Inkampani NXP USA INC. |
| uthotho | RS08 |
| Iphakheji | Iteyiphu kunye neReel (TR) |
| ubume bemveliso | ikhona evenkileni |
| iprosesa engundoqo | RS08 |
| Ukucaciswa kweKernel | 8 amasuntswana |
| isantya | 10MHz |
| Uqhagamshelwano | - |
| Iiperipherals | I-LVD, i-POR, i-WDT |
| I/O count | 2 |
| Inkqubo yokugcina umthamo | 1KB (1K x 8) |
| Uhlobo lwememori yenkqubo | flash |
| EEPROM umthamo | - |
| Ubungakanani be-RAM | 63×8 |
| IVoltage-Ubonelelo lwaMandla (Vcc/Vdd) | 1.8V ~ 5.5V |
| isiguquli sedatha | - |
| Uhlobo lweOscillator | ngaphakathi |
| Ubushushu bokusebenza | -40°C ~ 85°C (TA) |
| uhlobo lofakelo | Uhlobo lweNtaba yoMphezulu |
| Ipakethe/Indawo ebiyelweyo | I-6-VDFN eveziweyo yePad |
| Supplier Device Packaging | 6-DFN-EP (3×3) |
| Inombolo yemveliso esisiseko | MC9RS08 |
Amaxwebhu kunye neMidiya
| UHLOBO LWEZIBONELELO | LINK |
| Iinkcukacha | Idatha ye-MC9RS08KA1/2 |
| Iimodyuli zoqeqesho lwemveliso | Iimpawu eziphambili zeMC9RS08KA8 USBSpyder08 Discovery Kit |
| Ulwazi lokusingqongileyo | NXP USA Inc REACH211 Cert NXP USA Inc RoHS3 Cert |
| iveliso ezifakiwe | Umatshini wokuthengisa amatikiti |
| Ukutshintsha kweMveliso yePCN / Ukuyeka | Izixhobo ezininzi 03/Oct/2012 |
| Uyilo lwePCN/Inkcazo | QFN 3X3.4X4,5X5 indawo yeNdibano 12/Nov/2015 Ukurhoxiswa koyilo loyilo 16/Sep/2014 |
| INdibano yePCN/uMthombo | Indawo yeMult Dev iChgs 18/Dec/2020 |
| Iphakheji yePCN | IMult Dev Pkg Seal nge-15/Dec/2020 Lonke uHlaziyo lweLeyibhile yeDev nge-15/Dec/2020 |
Ulwahlulo lokusiNgqongileyo kunye noThunyelo ngaphandle
| IIMPAWU | CHAZA |
| Ubume beRoHS | Iyahambelana neenkcukacha ze-ROHS3 |
| iNqanaba lokuSenza ukufuma (MSL) | 3 (168 iiyure) |
| FIKA ubume | Iimveliso ezinga-REACH |
| ECCN | I-EAR99 |
| HTSUS | 8542.31.0001 |
