Iipropati zeMveliso
UHLOBO | CHAZA |
udidi | ISekethe eDityanisiweyo (IC) Ifakwe - Microcontrollers |
umenzi | Inkampani NXP USA INC. |
uthotho | Kinetis KEA |
Iphakheji | itreyi |
ubume bemveliso | ikhona evenkileni |
iprosesa engundoqo | I-ARM® Cortex®-M0+ |
Ukucaciswa kweKernel | 32-bit core enye |
isantya | 48MHz |
Uqhagamshelwano | I-CANbus, I²C, LINbus, SPI, UART/USART |
Iiperipherals | I-LVD, i-POR, i-PWM, i-WDT |
I/O count | 71 |
Inkqubo yokugcina umthamo | 128KB (128K x 8) |
Uhlobo lwememori yenkqubo | flash |
EEPROM umthamo | - |
Ubungakanani be-RAM | 16K x 8 |
IVoltage-Ubonelelo lwaMandla (Vcc/Vdd) | 2.7V ~ 5.5V |
isiguquli sedatha | A/D 16x12b |
Uhlobo lweOscillator | ngaphakathi |
Ubushushu bokusebenza | -40°C ~ 125°C (TA) |
uhlobo lofakelo | Uhlobo lweNtaba yoMphezulu |
Ipakethe/Indawo ebiyelweyo | 80-LQFP |
Supplier Device Packaging | 80-LQFP (14×14) |
Inombolo yemveliso esisiseko | S9KEAZ128 |
Amaxwebhu kunye neMidiya
UHLOBO LWEZIBONELELO | LINK |
Iinkcukacha | I-KEA128 Sub-Sapho |
ifayile yevidiyo | Isoftware ye-MCUXpresso kunye neSibhengezo seZixhobo esivela kuGeoff Lees |
Ulwazi lokusingqongileyo | NXP USA Inc REACH211 Cert NXP USA Inc RoHS3 Cert |
iveliso ezifakiwe | Umatshini wokuthengisa amatikiti |
Uyilo lwePCN/Inkcazo | KEA 30/Nov/2019 |
INdibano yePCN/uMthombo | Indawo yoVavanyo lweMult Dev 25/Mar/2021 |
Iphakheji yePCN | Lonke uHlaziyo lweLeyibhile yeDev nge-15/Dec/2020 IMult Dev Pkg Seal nge-15/Dec/2020 |
Iinkcukacha zeHTML | I-KEA128 Sub-Sapho |
Ulwahlulo lokusiNgqongileyo nokuThunyelelwa kwamanye amazwe
IIMPAWU | CHAZA |
Ubume beRoHS | Iyahambelana neenkcukacha ze-ROHS3 |
iNqanaba lokuSenza ukufuma (MSL) | 3 (168 iiyure) |
FIKA ubume | Iimveliso ezinga-REACH |
ECCN | 3A991A2 |
HTSUS | 8542.31.0001 |