Iipropati zeMveliso
| UHLOBO | CHAZA |
| udidi | ISekethe eDityanisiweyo (IC) Ifakwe - Microcontrollers |
| umenzi | Inkampani NXP USA INC. |
| uthotho | MPC56xx Qorivva |
| Iphakheji | itreyi |
| ubume bemveliso | ikhona evenkileni |
| iprosesa engundoqo | e200z0h |
| Ukucaciswa kweKernel | 32-bit core enye |
| isantya | 64MHz |
| Uqhagamshelwano | I-CANbus, I²C, LIN, SCI, SPI |
| Iiperipherals | DMA, POR, PWM, WDT |
| I/O count | 77 |
| Inkqubo yokugcina umthamo | 768KB (768K x 8) |
| Uhlobo lwememori yenkqubo | flash |
| EEPROM umthamo | 64K x 8 |
| Ubungakanani be-RAM | 64K x 8 |
| IVoltage-Ubonelelo lwaMandla (Vcc/Vdd) | 3V ~ 5.5V |
| isiguquli sedatha | A/D 7x10b, 5x12b |
| Uhlobo lweOscillator | ngaphakathi |
| Ubushushu bokusebenza | -40°C ~ 85°C (TA) |
| uhlobo lofakelo | Uhlobo lweNtaba yoMphezulu |
| Ipakethe/Indawo ebiyelweyo | I-100-LQFP |
| Supplier Device Packaging | 100-LQFP (14×14) |
| Inombolo yemveliso esisiseko | SPC5605 |
Amaxwebhu kunye neMidiya
| UHLOBO LWEZIBONELELO | LINK |
| Iinkcukacha | MPC560xB,C,D |
| Ulwazi lokusingqongileyo | NXP USA Inc RoHS3 Cert NXP USA Inc REACH211 Cert |
| iveliso ezifakiwe | Umatshini wokuthengisa amatikiti |
| Iphakheji yePCN | Lonke uHlaziyo lweLeyibhile yeDev nge-15/Dec/2020 IMult Dev Pkg Seal nge-15/Dec/2020 |
| Iinkcukacha zeHTML | MPC560xB, C, D |
Ulwahlulo lokusiNgqongileyo kunye noThunyelo ngaphandle
| IIMPAWU | CHAZA |
| Ubume beRoHS | Iyahambelana neenkcukacha ze-ROHS3 |
| iNqanaba lokuSenza ukufuma (MSL) | 3 (168 iiyure) |
| FIKA ubume | Iimveliso ezinga-REACH |
| ECCN | 3A991A2 |
| HTSUS | 8542.31.0001 |
