iimpawu zemveliso
UHLOBO CHAZA
udidi lweSekethe eDityanisiweyo (IC)
Inkumbulo-Uqwalaselo lwe-PROM yeFPGA
umenzi AMD Xilinx
uthotho -
Ukufakwa kombhobho wokupakisha
Ubume beMveliso iyekiwe
Uhlobo olucwangcisiweyo olunocwangco kwinkqubo
ugcino 2Mb
I-Voltage – Powered 3V ~ 3.6V
Ubushushu bokusebenza -40°C ~ 85°C
uhlobo lofakelo Uhlobo lweNtaba yoMphezulu
Ipakethe/I-Enclosure 20-TSSOP (0.173″, 4.40mm ububanzi)
Ukupakishwa kweSixhobo soMboneleli 20-TSSOP
Inombolo yemveliso esisiseko XCF02
Xela impazamo
Uphendlo olutsha lweParametric
Imidiya kunye nokukhutshelwa
UHLOBO LOHLOBO LINK
Iinkcazo XCFxx(S,P) Platform Flash PROMS
Ulwazi lokusingqongileyo Xilinx REACH211 Cert
Isatifikethi se-Xiliinx RoHS
PCN Product Utshintsho/Ukuyeka Mult Dev EOL 17/May/2021
Ukuphela koBomi 10/JAN/2022
Indibano yePCN/yeNdawo yoMthombo Chg 22/Feb/2016
Ulwahlulo lokusiNgqongileyo nokuThunyelelwa kwamanye amazwe
IIMPAWU ZICHAZA
Ubume be-RoHS Iyahambelana neenkcukacha ze-ROHS3
iNqanaba lokuSensitivity lokufuma (MSL) 3 (168 iiyure)
FIKELELA ubume Iimveliso ezingafikeleliyo
ECCN 3A991B1B1
HTSUS 8542.32.0071
