iimpawu zemveliso
UHLOBO CHAZA
udidi lweSekethe eDityanisiweyo (IC)
Inkumbulo-Uqwalaselo lwe-PROM yeFPGA
umenzi AMD Xilinx
uthotho -
Ipakethi yetreyi
Ubume beMveliso iyekiwe
Uhlobo olucwangcisiweyo olunocwangco kwinkqubo
yokugcina 8Mb
I-Voltage – Inamandla 1.65V ~ 2V
Ubushushu bokusebenza -40°C ~ 85°C
uhlobo lofakelo Uhlobo lweNtaba yoMphezulu
Iphakheji / i-Enclosure 48-TFBGA, CSPBGA
Ukupakishwa kweSixhobo soMboneleli 48-CSP (8×9)
Inombolo yemveliso esisiseko XCF08
Xela impazamo
Uphendlo olutsha lweParametric
Imidiya kunye nokukhutshelwa
UHLOBO LOHLOBO LINK
Iinkcazo XCFxx(S,P) Platform Flash PROMS
Isikhokelo somsebenzisi wePlatform Flash PROM
Platform Flash PROM Uhlaziyo
Ulwazi lokusingqongileyo Xiliinx RoHS Certificate
I-Xilinx REACH211 Cert
Ukutshintsha kweMveliso ye-PCN / Ukupheliswa kokuphela koBomi 10/JAN/2022
IMult Dev EOL 17/Meyi/2021
IiNkcazo ze-HTML zePlatifomu yeFlash ye-PROM yeSikhokelo soMsebenzisi
Platform Flash PROM Uhlaziyo
Ulwahlulo lokusiNgqongileyo nokuThunyelelwa kwamanye amazwe
IIMPAWU ZICHAZA
Ubume be-RoHS Ayihambelani ne-RoHS
iNqanaba lokuSensitivity lokufuma (MSL) 3 (168 iiyure)
FIKELELA ubume Iimveliso ezingafikeleliyo
ECCN 3A991B1B1
HTSUS 8542.32.0071
