iimpawu zemveliso
UHLOBO
CHAZA
udidi
ISekethe eDityanisiweyo (IC)
Inkumbulo-Uqwalaselo lwe-PROM yeFPGA
umenzi
AMD Xilinx
uthotho
-
Iphakheji
izixhobo zombhobho
Ubume beMveliso
intengiso yokugqibela
Uhlobo olunocwangciso
Iyacwangciswa kwisistim
yokugcina
2Mb
I-Voltage-Inamandla
3V ~ 3.6V
ubushushu bokusebenza
-40°C ~ 85°C
uhlobo lofakelo
Uhlobo lweNtaba yoMphezulu
Ipakethe/Indawo ebiyelweyo
20-TSSOP (0.173″, 4.40mm ububanzi)
Supplier Device Packaging
20-TSSOP
Inombolo yemveliso esisiseko
XCF02
Imidiya kunye nokukhutshelwa
UHLOBO LWEZIBONELELO
LINK
Iinkcukacha
XCFxx(S,P) Platform Flash PROMS
Ulwazi lokusingqongileyo
Isatifikethi se-Xiliinx RoHS
I-Xilinx REACH211 Cert
Ukutshintsha kweMveliso yePCN / Ukuyeka
Izixhobo ezininzi 01/Juni/2015
Isixhobo seMult EOL Rev3 9/May/2016
Ukuphela koBomi 10/JAN/2022
Inxalenye yePCN yoTshintsho lwesimo
Amacandelo Avuselelwe 25/Apr/2016
Imodeli ye-EDA/CAD
xcf02svo20c nguMphathi wethala leencwadi
Ulwahlulo lokusiNgqongileyo nokuThunyelelwa kwamanye amazwe
IIMPAWU
CHAZA
Ubume beRoHS
Ayihambelani neRoHS
iNqanaba lokuSenza ukufuma (MSL)
3 (168 iiyure)
FIKA ubume
Iimveliso ezinga-REACH
ECCN
3A991B1B1
HTSUS
8542.32.0071
