iimpawu zemveliso
UHLOBO
CHAZA
udidi
ISekethe eDityanisiweyo (IC)
Inkumbulo-Uqwalaselo lwe-PROM yeFPGA
umenzi
AMD Xilinx
uthotho
-
Iphakheji
izixhobo zombhobho
Ubume beMveliso
iyekisiwe
Uhlobo olunocwangciso
Iyacwangciswa kwisistim
yokugcina
1Mb
I-Voltage-Inamandla
3V ~ 3.6V
ubushushu bokusebenza
-40°C ~ 85°C
uhlobo lofakelo
Uhlobo lweNtaba yoMphezulu
Ipakethe/Indawo ebiyelweyo
20-TSSOP (0.173″, 4.40mm ububanzi)
Supplier Device Packaging
20-TSSOP
Inombolo yemveliso esisiseko
XCF01
Imidiya kunye nokukhutshelwa
UHLOBO LWEZIBONELELO
LINK
Iinkcukacha
XCFxx(S,P) Platform Flash PROMS
Ulwazi lokusingqongileyo
I-Xilinx REACH211 Cert
Isatifikethi se-Xiliinx RoHS
Ukutshintsha kweMveliso yePCN / Ukuyeka
IMult Dev EOL 17/Meyi/2021
Ukuphela koBomi 10/JAN/2022
INdibano yePCN/uMthombo
Indawo Chg 22/Feb/2016
Ulwahlulo lokusiNgqongileyo nokuThunyelelwa kwamanye amazwe
IIMPAWU
CHAZA
Ubume beRoHS
Iyahambelana neenkcukacha ze-ROHS3
iNqanaba lokuSenza ukufuma (MSL)
3 (168 iiyure)
FIKA ubume
Iimveliso ezinga-REACH
ECCN
3A991B1B2
HTSUS
8542.32.0071
