iimpawu zemveliso
UHLOBO
CHAZA
udidi
ISekethe eDityanisiweyo (IC)
Inkumbulo-Uqwalaselo lwe-PROM yeFPGA
umenzi
AMD Xilinx
uthotho
-
Iphakheji
izixhobo zombhobho
Ubume beMveliso
iyekisiwe
Uhlobo olunocwangciso
Iyacwangciswa kwisistim
yokugcina
512kb
I-Voltage-Inamandla
3V ~ 3.6V
Ubushushu bokusebenza
-40°C ~ 85°C
uhlobo lofakelo
Uhlobo lweNtaba yoMphezulu
Ipakethe/Indawo ebiyelweyo
20-SOIC (0.295″, 7.50mm ububanzi)
Supplier Device Packaging
20-SOIC
Inombolo yemveliso esisiseko
XC18V512
Imidiya kunye nokukhutshelwa
UHLOBO LWEZIBONELELO
LINK
Iinkcukacha
XC18V00 Series
Ulwazi lokusingqongileyo
I-Xilinx REACH211 Cert
Isatifikethi se-Xiliinx RoHS
Ukutshintsha kweMveliso yePCN / Ukuyeka
XC18V256/XC18V00 I-grade 1/Sept/2004
Iinkcukacha zeHTML
XC18V00 Series
Ulwahlulo lokusiNgqongileyo nokuThunyelelwa kwamanye amazwe
IIMPAWU
CHAZA
Ubume beRoHS
Ayihambelani neRoHS
iNqanaba lokuSenza ukufuma (MSL)
1 (ayinasiphelo)
FIKA ubume
Iimveliso ezinga-REACH
ECCN
3A991B1B2
HTSUS
8542.32.0051
