iimpawu zemveliso
UHLOBO CHAZA
udidi lweSekethe eDityanisiweyo (IC)
Inkumbulo-Uqwalaselo lwe-PROM yeFPGA
umenzi AMD Xilinx
uthotho -
Ukufakwa kombhobho wokupakisha
Ubume beMveliso iyekiwe
Uhlobo olunocwangciso lwe-OTP
ugcino 256Kb
I-Voltage - i-Powered 4.5V ~ 5.5V
Ubushushu bokusebenza -40°C ~ 85°C
uhlobo lofakelo Uhlobo lweNtaba yoMphezulu
Ipakethe/I-Enclosure 20-LCC (J lead)
Ukupakishwa kwesixhobo soMboneleli 20-PLCC (9 × 9)
Inombolo yemveliso esisiseko XC17256E
Xela impazamo
Uphendlo olutsha lweParametric
Imidiya kunye nokukhutshelwa
UHLOBO LOHLOBO LINK
Iinkcukacha XC1700E,EL,L Series PROMs
Ulwazi lokusingqongileyo Xilinx REACH211 Cert
Isatifikethi se-Xiliinx RoHS
PCN Product Change/Discontinuation XC4000E,XLA,1700L,E,EL,17S00,XL Families 28/Jul/2010
XC1700, 5200, HQ, SCD Families 19/Jul/2010
Ulwahlulo lokusiNgqongileyo nokuThunyelelwa kwamanye amazwe
IIMPAWU ZICHAZA
Ubume be-RoHS Ayihambelani ne-RoHS
iNqanaba lokuSensitivity lokufuma (MSL) 3 (168 iiyure)
FIKELELA ubume Iimveliso ezingafikeleliyo
ECCN EAR99
HTSUS 8542.32.0061