iimpawu zemveliso:
| UHLOBO | CHAZA |
| udidi | ISekethe eDityanisiweyo (IC) Ihlonyelwe - FPGA (UMmandla oLungiselelayo weSango) |
| umenzi | AMD Xilinx |
| uthotho | I-Spartan®-6 LX |
| Iphakheji | itreyi |
| ubume bemveliso | ikhona evenkileni |
| Inani le-LAB/CLB | 1139 |
| Inani lengqiqo/iiyunithi | 14579 |
| Iibits ze-RAM zizonke | 589824 |
| I/O count | 232 |
| I-Voltage - Inamandla | 1.14V ~ 1.26V |
| uhlobo lofakelo | Uhlobo lweNtaba yoMphezulu |
| Ubushushu bokusebenza | -40°C ~ 100°C (TJ) |
| Ipakethe/Indawo ebiyelweyo | 324-LFBGA, CSPBGA |
| Supplier Device Packaging | 324-CSPBGA (15x15) |
| Inombolo yemveliso esisiseko | XC6SLX16 |
Xela impazamo
Uphendlo olutsha lweParametric
Ulwahlulo lokusiNgqongileyo noThunyelo ngaphandle:
| IIMPAWU | CHAZA |
| Ubume beRoHS | Iyahambelana neenkcukacha ze-ROHS3 |
| iNqanaba lokuSenza ukufuma (MSL) | 3 (168 iiyure) |
| FIKA ubume | Iimveliso ezinga-REACH |
| ECCN | 3A991D |
| HTSUS | 8542.39.0001 |
Amanqaku:
1. Zonke ii-voltages zihambelana nomhlaba.
2. Jonga i-Interface Performances yeMemory Interfaces kwiTheyibhile 25. Uluhlu lwentsebenzo olwandisiweyo lucacisiwe kuyilo olungasebenzisi
Uluhlu lombane oluqhelekileyo lweVCCINT.Uluhlu lombane oluqhelekileyo lweVCCINT lusetyenziselwa:
• Uyilo olungasebenzisi i-MCB
• Izixhobo ze-LX4
• Izixhobo kwi TQG144 okanye CPG196 ipakethe
• Izixhobo ezinesantya se--3N
3. Okucetyiswayo ukuthotywa kwamandla ombane aphezulu kwi-VCCAUX yi-10 mV/ms.
4. Ngexesha lokucwangcisa, ukuba i-VCCO_2 yi-1.8V, ngoko i-VCCAUX kufuneka ibe yi-2.5V.
5. Izixhobo ze--1L zifuna i-VCCAUX = 2.5V xa usebenzisa i-LVDS_25, LVDS_33, BLVDS_25, LVPECL_25, RSDS_25, RSDS_33, PPDS_25,
kunye nemigangatho ye-PPDS_33 ye-I/O kumagalelo.I-LVPECL_33 ayixhaswanga kwizixhobo ze--1L.
6. Idatha yoqwalaselo igcinwa nokuba iVCCO yehla kwi-0V.
7. Ibandakanya i-VCCO ye-1.2V, 1.5V, 1.8V, 2.5V, kunye ne-3.3V.
8. Kwiinkqubo ze-PCI, umthumeli kunye nomamkeli kufuneka abe nezinto eziqhelekileyo zeVCCO.
9. Izixhobo ezinezinga le--1L lesantya azixhasi i-Xilinx PCI IP.
10. Ungagqithi kwi-100 mA iyonke kwibhanki nganye.
11. I-VBATT iyadingeka ukugcina i-RAM (BBR) iqhosha le-AES yebhetri xa i-VCCAUX ingasetyenziswanga.Nje ukuba i-VCCAUX isetyenziswe, i-VBATT ingaba
engadityaniswanga.Xa i-BBR ingasetyenziswanga, i-Xilinx icebisa ukuba uqhagamshelane ne-VCCAUX okanye i-GND.Nangona kunjalo, i-VBATT ayinakudityaniswa.Spartan-6 FPGA Data Sheet: DC kunye noTshintsho lweempawu
DS162 (v3.1.1) NgoJanuwari 30, 2015
www.xilinx.com
Ukucaciswa kweMveliso
4
Itheyibhile 3: i-eFUSE Programming Conditions(1)
INkcazelo yoMfaniswano iMinithi yesiTyhilelo esiKhulu
VFS(2)
Unikezelo lombane lwangaphandle
3.2 3.3 3.4 V
IFS
VFS unikezelo lwangoku
– – 40 mA
I-VCCAUX yombane wobonelelo oluncedisayo xa ithelekiswa ne-GND 3.2 3.3 3.45 V
RFUSE(3) Isichasi sangaphandle ukusuka kwi-RFUSE pin ukuya kwi-GND 1129 1140 1151
Ω
VCCINT
Umbane wobonelelo lwangaphakathi xa uthelekiswa ne-GND 1.14 1.2 1.26 V
tj
Uluhlu lobushushu
15 – 85 °C
Amanqaku:
1. Ezi nkcukacha zisebenza ngexesha lokwenziwa kweprogram yeqhosha le-eFUSE AES.Inkqubo ixhaswa kuphela nge-JTAG.Isitshixo se-AES kuphela
ixhaswa kwezi zixhobo zilandelayo: LX75, LX75T, LX100, LX100T, LX150, kunye neLX150T.
2. Xa kusenziwa iprogram eFUSE, iVFS mayibe ngaphantsi okanye ilingane neVCCAUX.Xa ingasetyenziswanga okanye xa i-eFUSE ingasetyenziswanga, iXilinx
icebisa ukudibanisa iVFS kwiGND.Nangona kunjalo, i-VFS inokuba phakathi kwe-GND kunye ne-3.45 V.
3. Isixhathisi se-RFUSE siyafuneka xa ucwangcisa iqhosha le-eFUSE AES.Xa ingasetyenziswanga okanye xa i-eFUSE ingasetyenziswanga, iXilinx
icebisa ukudibanisa i-RFUSE pin kwi-VCCAUX okanye i-GND.Nangona kunjalo, i-RFUSE ayinakuqhagamshelwa.
