iimpawu zemveliso
UHLOBO
CHAZA
udidi
ISekethe eDityanisiweyo (IC)
Ihlonyelwe-Inkqubo kwiChip (SoC)
umenzi
AMD Xilinx
uthotho
Zynq® UltraScale+™ MPSoC CG
Iphakheji
itreyi
Ubume beMveliso
ikhona evenkileni
Uyilo lwezakhiwo
MCU, FPGA
iprosesa engundoqo
IDual Core ARM® Cortex®-A53 MPCore™ eneCoreSight™, iDual Core ARM® Cortex™-R5 eneCoreSight™
Ubungakanani befleshi
-
Ubungakanani be-RAM
256 KB
Iiperipherals
I-DMA, WDT
Uqhagamshelwano
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
isantya
533MHz, 1.3GHz
uphawu oluphambili
Zynq® UltraScale+™ FPGA, 103K+ iiseli zengqiqo
ubushushu bokusebenza
-40°C ~ 100°C (TJ)
Ipakethe/Indawo ebiyelweyo
784-BFBGA, FCBGA
Supplier Device Packaging
784-FCBGA (23×23)
I/O count
252
Inombolo yemveliso esisiseko
XCZU2
Imidiya kunye nokukhutshelwa
UHLOBO LWEZIBONELELO
LINK
Iinkcukacha
Zynq UltraScale+ MPSoC Overview
Ulwazi lokusingqongileyo
Isatifikethi se-Xiliinx RoHS
I-Xilinx REACH211 Cert
Imodeli ye-EDA/CAD
XCZU2CG-2SFVC784I ngu-SnapEDA
Ulwahlulo lokusiNgqongileyo nokuThunyelelwa kwamanye amazwe
IIMPAWU
CHAZA
Ubume beRoHS
Iyahambelana neenkcukacha ze-ROHS3
iNqanaba lokuSenza ukufuma (MSL)
4 (72 iiyure)
FIKA ubume
Iimveliso ezinga-REACH
ECCN
5A002A4 XIL
HTSUS
8542.39.0001
