iimpawu zemveliso
UHLOBO CHAZA
udidi lweSekethe eDityanisiweyo (IC)
Ihlonyelwe-i-CPLD (Isixhobo esiNxibelekayo esinoQoqosho oluQinisekayo)
umenzi AMD Xilinx
series CoolRunner XPLA3
Ukufakwa kombhobho wokupakisha
Ubume beMveliso iyekiwe
Uhlobo olucwangcisiweyo lwangaphakathi lwenkqubo (ubuncinane benkqubo ye-1K/imijikelo yokucima)
Ixesha lokulibazisa tpd(1) max 5.5ns
Unikezelo lweVoltage – Ngaphakathi 3V ~ 3.6V
Inani leengongoma zengqiqo/iibhloko 4
Inani lee-macrocell 64
Inombolo yesango 1500
I/O ndibala 36
Ubushushu bokusebenza 0°C ~ 70°C (TA)
uhlobo lofakelo Uhlobo lweNtaba yoMphezulu
Ipakethe/I-Enclosure 44-LCC (J lead)
Ukupakishwa kwesixhobo soMboneleli 44-PLCC (16.59 × 16.59)
Inombolo yemveliso esisiseko XCR3064XL
Xela impazamo
Uphendlo olutsha lweParametric
Imidiya kunye nokukhutshelwa
UHLOBO LOHLOBO LINK
Iimpawu eziphambili zeXCR3064XL
I-CoolRunner XPLA3 CPLDs
Ulwazi lokusingqongileyo Xiliinx RoHS Certificate
I-Xilinx REACH211 Cert
INdibano yePCN/Umthombo weMult Dev LeadFrame Chg 29/Oct/2018
Iimpawu zeHTML XCR3064XL
Ulwahlulo lokusiNgqongileyo nokuThunyelelwa kwamanye amazwe
IIMPAWU ZICHAZA
Ubume be-RoHS Ayihambelani ne-RoHS
iNqanaba lokuSensitivity lokufuma (MSL) 3 (168 iiyure)
FIKELELA ubume Iimveliso ezingafikeleliyo
ECCN EAR99
HTSUS 8542.39.0001
