iimpawu zemveliso
UHLOBO CHAZA
udidi lweSekethe eDityanisiweyo (IC)
Inkumbulo-Uqwalaselo lwe-PROM yeFPGA
umenzi AMD Xilinx
uthotho -
Ipakethi yetreyi
Ubume beMveliso iyekiwe
Uhlobo olucwangcisiweyo olunocwangco kwinkqubo
ugcino 32Mb
I-Voltage – Inamandla 1.65V ~ 2V
Ubushushu bokusebenza -40°C ~ 85°C
uhlobo lofakelo Uhlobo lweNtaba yoMphezulu
Ipakethe/I-Enclosure 48-TFSOP (0.724″, 18.40mm ububanzi)
Ukupakishwa kweSixhobo soMboneleli 48-TSOP
Inombolo yemveliso esisiseko XCF32
Xela impazamo
Uphendlo olutsha lweParametric
Imidiya kunye nokukhutshelwa
UHLOBO LOHLOBO LINK
Iinkcazo XCFxx(S,P) Platform Flash PROMS
Ulwazi lokusingqongileyo Xiliinx RoHS Certificate
I-Xilinx REACH211 Cert
Ukutshintsha kweMveliso ye-PCN / Ukupheliswa kokuphela koBomi 10/JAN/2022
IMult Dev EOL 17/Meyi/2021
Ulwahlulo lokusiNgqongileyo nokuThunyelelwa kwamanye amazwe
IIMPAWU ZICHAZA
Ubume be-RoHS Iyahambelana neenkcukacha ze-ROHS3
iNqanaba lokuSensitivity lokufuma (MSL) 3 (168 iiyure)
FIKELELA ubume Iimveliso ezingafikeleliyo
ECCN 3A991B1A
HTSUS 8542.32.0071
