iimpawu zemveliso
UHLOBO
CHAZA
udidi
ISekethe eDityanisiweyo (IC)
Ihlonyelwe-Inkqubo kwiChip (SoC)
umenzi
AMD Xilinx
uthotho
Zynq®-7000
Iphakheji
itreyi
Ubume beMveliso
ikhona evenkileni
Uyilo lwezakhiwo
MCU, FPGA
iprosesa engundoqo
Enye i-ARM® Cortex®-A9 MPCore™ eneCoreSight™
Ubungakanani befleshi
-
Ubungakanani be-RAM
256 KB
Iiperipherals
I-DMA
Uqhagamshelwano
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
isantya
667MHz
uphawu oluphambili
Artix™-7 FPGA, 23K iiseli logic
Ubushushu bokusebenza
0°C ~ 85°C (TJ)
Ipakethe/Indawo ebiyelweyo
225-LFBGA, CSPBGA
Supplier Device Packaging
225-CSPBGA (13×13)
I/O count
54
Inombolo yemveliso esisiseko
XC7Z007
Imidiya kunye nokukhutshelwa
UHLOBO LWEZIBONELELO
LINK
Iinkcukacha
Zynq-7000 All Programmable SoC Overview
Inkcazo ye-Zynq-7000 SoC
Zynq-7000 Isikhokelo somsebenzisi
Ulwazi lokusingqongileyo
I-Xilinx REACH211 Cert
Isatifikethi se-Xiliinx RoHS
iveliso ezifakiwe
TE0723 ArduZynq Series kunye Xilinx Zynq®-Z-7010/Z-7007S SoCs
Yonke iProgrammable Zynq®-7000 SoC
Imodeli ye-EDA/CAD
XC7Z007S-1CLG225C ngu-SnapEDA
Ulwahlulo lokusiNgqongileyo nokuThunyelelwa kwamanye amazwe
IIMPAWU
CHAZA
Ubume beRoHS
Iyahambelana neenkcukacha ze-ROHS3
iNqanaba lokuSenza ukufuma (MSL)
3 (168 iiyure)
FIKA ubume
Iimveliso ezinga-REACH
ECCN
3A991D
HTSUS
8542.39.0001
