iimpawu zemveliso
UHLOBO
CHAZA
udidi
ISekethe eDityanisiweyo (IC)
Ihlonyelwe-Inkqubo kwiChip (SoC)
umenzi
AMD Xilinx
uthotho
Iimoto, AEC-Q100, Zynq®-7000 XA
Iphakheji
itreyi
Ubume beMveliso
ikhona evenkileni
Uyilo lwezakhiwo
MCU, FPGA
iprosesa engundoqo
I-Dual ARM® Cortex®-A9 MPCore™ eneCoreSight™
Ubungakanani befleshi
-
Ubungakanani be-RAM
256 KB
Iiperipherals
I-DMA
Uqhagamshelwano
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
isantya
667MHz
uphawu oluphambili
Artix™-7 FPGA, 28K iiseli zengqiqo
ubushushu bokusebenza
-40°C ~ 100°C (TJ)
Ipakethe/Indawo ebiyelweyo
400-LFBGA, CSPBGA
Supplier Device Packaging
400-CSPBGA (17×17)
I/O count
130
Imidiya kunye nokukhutshelwa
UHLOBO LWEZIBONELELO
LINK
Iinkcukacha
XA Zynq-7000 Isishwankathelo
Inkcazo ye-Zynq-7000 SoC
Ulwazi lokusingqongileyo
Isatifikethi se-Xiliinx RoHS
I-Xilinx REACH211 Cert
Iinkcukacha zeHTML
Inkcazo ye-Zynq-7000 SoC
XA Zynq-7000 Isishwankathelo
Ulwahlulo lokusiNgqongileyo nokuThunyelelwa kwamanye amazwe
IIMPAWU
CHAZA
Ubume beRoHS
Iyahambelana neenkcukacha ze-ROHS3
iNqanaba lokuSenza ukufuma (MSL)
4 (72 iiyure)
FIKA ubume
Iimveliso ezinga-REACH
ECCN
I-EAR99
HTSUS
8542.39.0001
