Iipropati zeMveliso
| UHLOBO | CHAZA |
| udidi | ISekethe eDityanisiweyo (IC) Ifakwe - Microcontrollers |
| umenzi | Inkampani NXP USA INC. |
| uthotho | MPC57xx |
| Iphakheji | itreyi |
| ubume bemveliso | ikhona evenkileni |
| iprosesa engundoqo | e200z2, e200z4 |
| Ukucaciswa kweKernel | 32-bit core ezimbini |
| isantya | 80MHz/160MHz |
| Uqhagamshelwano | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG |
| Iiperipherals | DMA , LVD , POR , WDT |
| Inani le-I / O | 246 |
| Inkqubo yokugcina umthamo | 4MB (4M x 8) |
| Uhlobo lwememori yenkqubo | flash |
| EEPROM umthamo | - |
| Ubungakanani be-RAM | 512K x 8 |
| IVoltage-Ubonelelo lwaMandla (Vcc/Vdd) | 3V ~ 5.5V |
| isiguquli sedatha | A/D 80x10b, 64x12b |
| Uhlobo lweOscillator | ngaphakathi |
| Ubushushu bokusebenza | -40°C ~ 105°C (TA) |
| uhlobo lofakelo | Uhlobo lweNtaba yoMphezulu |
| Ipakethe/Indawo ebiyelweyo | 324-LBGA |
| Supplier Device Packaging | 324-MAPBGA (19×19) |
| Inombolo yemveliso esisiseko | SPC5747 |
Amaxwebhu kunye neMidiya
| UHLOBO LWEZIBONELELO | LINK |
| Ulwazi lokusingqongileyo | NXP USA Inc RoHS3 Cert NXP USA Inc REACH211 Cert |
| iveliso ezifakiwe | Umatshini wokuthengisa amatikiti |
| INdibano yePCN/uMthombo | Indawo yeMult Dev A/T 28/Apr/2021 |
| Iphakheji yePCN | IMult Dev Pkg Seal nge-15/Dec/2020 Lonke uHlaziyo lweLeyibhile yeDev nge-15/Dec/2020 |
Ulwahlulo lokusiNgqongileyo kunye noThunyelo ngaphandle
| IIMPAWU | CHAZA |
| Ubume beRoHS | Iyahambelana neenkcukacha ze-ROHS3 |
| iNqanaba lokuSenza ukufuma (MSL) | 3 (168 iiyure) |
| FIKA ubume | Iimveliso ezinga-REACH |
| BALEKA | 5A992C |
| HTSUS | 8542.31.0001 |
