Iinkcukacha zeMveliso
Iithegi zeMveliso
Iipropati zeMveliso
UHLOBO | CHAZA |
udidi | ISekethe eDityanisiweyo (IC) Ifakwe - Microcontrollers |
umenzi | Inkampani NXP USA INC. |
uthotho | MPC56xx Qorivva |
Iphakheji | itreyi |
ubume bemveliso | ikhona evenkileni |
iprosesa engundoqo | e200z0h |
Ukucaciswa kweKernel | 32-bit core enye |
isantya | 48MHz |
Uqhagamshelwano | CANbus,I²C,LIN,SCI,SPI |
Iiperipherals | DMA , POR , PWM , WDT |
Inani le-I / O | 45 |
Inkqubo yokugcina umthamo | 512KB (512K x 8) |
Uhlobo lwememori yenkqubo | flash |
EEPROM umthamo | 64K x 8 |
Ubungakanani be-RAM | 32K x 8 |
IVoltage-Ubonelelo lwaMandla (Vcc/Vdd) | 3V ~ 5.5V |
isiguquli sedatha | A/D 12x10b |
Uhlobo lweOscillator | ngaphakathi |
Ubushushu bokusebenza | -40°C ~ 125°C (TA) |
uhlobo lofakelo | Uhlobo lweNtaba yoMphezulu |
Ipakethe/Indawo ebiyelweyo | 64-LQFP |
Supplier Device Packaging | 64-LQFP (10×10) |
Inombolo yemveliso esisiseko | SPC5604 |
Amaxwebhu kunye neMidiya
UHLOBO LWEZIBONELELO | LINK |
Ulwazi lokusingqongileyo | NXP USA Inc REACH211 Cert NXP USA Inc RoHS3 Cert |
iveliso ezifakiwe | Umatshini wokuthengisa amatikiti |
Uyilo lwePCN/Inkcazo | I-Mult Dev DS Chg 11/Feb/2022 |
INdibano yePCN/uMthombo | Indawo yoVavanyo lwe-Mult Dev nge-25/Mar/2021 |
Iphakheji yePCN | IMult Dev Pkg Seal nge-15/Dec/2020 |
Ulwahlulo lokusiNgqongileyo nokuThunyelelwa kwamanye amazwe
IIMPAWU | CHAZA |
Ubume beRoHS | Iyahambelana neenkcukacha ze-ROHS3 |
iNqanaba lokuSenza ukufuma (MSL) | 3 (168 iiyure) |
FIKA ubume | Iimveliso ezinga-REACH |
BALEKA | 3A991A2 |
HTSUS | 8542.31.0001 |
Ngaphambili: IiSekethe eziDityanisiweyo eziNtsha zoqobo ze-SPC572L64E3BC6AR Okulandelayo: IiSekethe eziNtsha eziDityanisiweyo zoqobo eziNtsha SPC5604BK0CLL6