iimpawu zemveliso
UHLOBO
CHAZA
udidi
ISekethe eDityanisiweyo (IC)
Ihlonyelwe - FPGA (UMmandla oLungiselelayo weSango)
umenzi
Iteknoloji yeMicrochip
uthotho
I-ProASIC3L
Iphakheji
itreyi
Ubume beMveliso
ikhona evenkileni
Iibits ze-RAM zizonke
110592
I/O count
97
Inombolo yesango
600000
I-Voltage-Inamandla
1.14V ~ 1.575V
uhlobo lofakelo
Uhlobo lweNtaba yoMphezulu
ubushushu bokusebenza
0°C ~ 85°C (TJ)
Ipakethe/Indawo ebiyelweyo
144-LBGA
Supplier Device Packaging
144-FPBGA (13×13)
Inombolo yemveliso esisiseko
A3P600
Imidiya kunye nokukhutshelwa
UHLOBO LWEZIBONELELO
LINK
Iinkcukacha
ProASIC3L FPGA IsiKhokelo seFabric
iveliso ezifakiwe
ProASIC®3 FPGA yoSapho
Uyilo lwePCN/Inkcazo
Ingcebiso yoYilo lweMult Dev 13/Oct/2017
Mult Dev Software Chg 8/Oct/2018
INdibano yePCN/uMthombo
Indawo yeNdibano 15/Feb/2022
Inxalenye yePCN yoTshintsho lwesimo
Izixhobo ezininzi nge-19/Juni/2017
Iinkcukacha zeHTML
ProASIC3L FPGA IsiKhokelo seFabric
Ulwahlulo lokusiNgqongileyo nokuThunyelelwa kwamanye amazwe
IIMPAWU
CHAZA
Ubume beRoHS
RoHS iyahambelana
iNqanaba lokuSenza ukufuma (MSL)
3 (168 iiyure)
FIKA ubume
Iimveliso ezinga-REACH
ECCN
3A991D
HTSUS
8542.39.0001
