I-Intel ityala enye i-20 yeebhiliyoni zeedola ukwakha iifektri ezimbini zetshiphu.Inkosi yeteknoloji "1.8nm" ibuya

Nge-9 kaSeptemba, ixesha lasekhaya, i-Intel CEO uKissinger wabhengeza ukuba uza kutyala imali ezibhiliyoni ezingama-20 zeedola ukwakha umzi-mveliso omtsha omkhulu we-wafer e-Ohio, eUnited States.Le yinxalenye yesicwangciso se-Intel IDM 2.0.Isicwangciso sotyalo-mali sisonke siphezulu njenge-100 yeebhiliyoni zeedola.I-factory entsha kulindeleke ukuba iveliswe ngobuninzi kwi-2025. Ngelo xesha, inkqubo "ye-1.8nm" iya kubuyisela i-Intel kwindawo yenkokheli ye-semiconductor.

Ukusukela ekubeni waba yi-Intel CEO ngoFebruwari kulo nyaka uphelileyo, uKissinger ukhuthaze ngamandla ukwakhiwa kweefektri e-United States nakwihlabathi liphela, apho ubuncinci i-US $ 40 yeebhiliyoni ityalwe eMelika.Kunyaka ophelileyo, utyale imali ezibhiliyoni ezingama-20 zeedola e-Arizona ukwakha umzi-mveliso we-wafer.Ngeli xesha, watyala imali ye-US $ 20 yeebhiliyoni e-Ohio, kwaye wakha umzi-mveliso omtsha wokutywina kunye nokuvavanya eNew Mexico.

I-Intel ityala enye i-20 yeebhiliyoni zeedola ukwakha iifektri ezimbini zetshiphu.Inkosi yeteknoloji "1.8nm" ibuya

Umzi-mveliso we-Intel ukwangumzi-mveliso omkhulu we-semiconductor wetshiphu osanda kwakhiwa e-United States emva kokuwiswa kwetyala lenkxaso ye-chip ye-52.8 yeebhiliyoni zeedola zaseMelika.Ngenxa yesi sizathu, umongameli wase-United States naye waya kumsitho wokuqalisa, kunye nerhuluneli yaseOhio namanye amagosa aphezulu kumasebe asekuhlaleni.

I-Intel ityala enye i-20 yeebhiliyoni zeedola ukwakha iifektri ezimbini zetshiphu.Inkosi yeteknoloji "1.8nm" ibuya

Isiseko sokwenziwa kwetshiphu ye-Intel siya kwenziwa ziifektri ezimbini ezisicaba, ezinokuthatha ukuya kuthi ga kwiifektri ezisibhozo kunye nokuxhasa iinkqubo zenkxaso yendalo.Igubungela indawo ephantse ibe yi-1000 yeehektare, oko kukuthi, i-4 square kilometers.Iza kudala imisebenzi engama-3000 ehlawula kakhulu, imisebenzi yokwakha engama-7000, kunye namashumi amawaka emisebenzi yentsebenziswano yobonelelo ngempahla.

Ezi fektri zimbini ze-wafer kulindeleke ukuba zivelise ubunzima ngo-2025. I-Intel ayizange ichaze ngokuthe ngqo inqanaba lenkqubo yefektri, kodwa i-Intel yathi ngaphambili yayiza kuyilawula inkqubo ye-CPU yesi-5 kwiminyaka emi-4, kwaye iya kuvelisa i-20a. kunye ne-18a ezimbini iinkqubo zesizukulwana ngo-2024. Ke ngoko, umzi-mveliso apha kufuneka uvelise inkqubo ye-18a ngelo xesha.

I-20a kunye ne-18a yinkqubo yokuqala ye-chip yehlabathi ukufikelela kwinqanaba le-EMI, elilingana ne-2nm kunye ne-1.8nm iinkqubo zabahlobo.Baza kuphehlelela kwakhona iiteknoloji ezimbini ze-Intel black technology, iribhoni yeFET kunye ne-powervia.

Ngokutsho kwe-Intel, i-ribbonfet kukuphunyezwa kwe-Intel yesango ngeenxa zonke kwii-transistors.Iya kuba yinto yokuqala entsha yokwakhiwa kwe-transistor ukususela ekuqaleni kwenkampani i-FinFET yokuqala ngo-2011. Le teknoloji ikhawulezisa isantya sokutshintsha se-transistor kwaye ifezekise i-drive current efanayo njenge-multifin structure, kodwa ithatha indawo encinci.

I-Powervia yeyona nto ikhethekileyo ye-Intel kunye nenethiwekhi yokuqala yothumelo lwamandla emva kweshishini, eyenza ukuhanjiswa komqondiso ngokuphelisa imfuno yonikezelo lwamandla kunye.