Imakethi ye-OEM, esemanzini anzulu, iye yakhathazeka kakhulu kutshanje.Emva kokuba i-Samsung ithe iyakuvelisa i-1.4nm ngo-2027 kwaye i-TSMC inokubuyela kwitrone ye-semiconductor, i-Intel iphinde yasungula "inqanaba lenkqubo ye-OEM" ukuncedisa ngamandla i-IDM2.0.
KwiNgqungquthela yeInnovation ye-Intel On Technology ebibanjwe kutshanje, i-CEO uPat Kissinger ubhengeze ukuba i-Intel OEM Service (IFS) iya kuzisa ixesha "lenqanaba lenkqubo ye-OEM".Ngokungafaniyo nemowudi ye-OEM yesiko ebonelela kuphela abathengi ngesakhono sokwenza i-wafer, i-Intel iya kubonelela ngesisombululo esibanzi esigquma ii-wafers, iipakethi, isoftware kunye neechips.UKissinger ugxininise ukuba "oku kuphawula utshintsho lweparadigm ukusuka kwinkqubo kwi-chip ukuya kwinkqubo kwiphakheji."
Emva kokuba i-Intel ikhawulezise imatshi yayo isiya kwi-IDM2.0, yenze izinto ezithe gqolo mva nje: nokuba ivula i-x86, ukujoyina inkampu yeRISC-V, ukufumana inqaba, ukwandisa umanyano lwe-UCIe, ibhengeza amashumi eebhiliyoni zeedola zesicwangciso sokwandisa umgca we-OEM, njl. ., ebonisa ukuba iya kuba nethemba lasendle kwimarike ye-OEM.
Ngoku, ngaba i-Intel, enike "intshukumo enkulu" yokwenziwa kwekhontrakthi yenqanaba lenkqubo, yongeza ezinye iitshiphusi kumlo we "Emperors ezintathu"?
"Ukuphuma" kwinqanaba lenkqubo ye-OEM ingcamango sele ilandelwe.
Emva kokucotha koMthetho kaMoore, ukufikelela kwibhalansi phakathi koxinzelelo lwe-transistor, ukusetyenziswa kwamandla kunye nobukhulu kujongene nemingeni eyongezelelweyo.Nangona kunjalo, izicelo ezivelayo ziya zifuna ukusebenza okuphezulu, amandla ekhompyuter anamandla kunye neechips ezidibeneyo ezidibeneyo, eziqhuba ishishini ukuba liphonononge izisombululo ezitsha.
Ngoncedo loyilo, ukuveliswa, ukupakishwa okuphezulu kunye nokunyuka kwamva nje kweChiplet, kubonakala ngathi kuye kwaba yimvumelwano yokuqonda "ukusinda" koMthetho kaMoore kunye nokuguqulwa okuqhubekayo kokusebenza kwe-chip.Ngokukodwa kwimeko yokunciphisa inkqubo yokunciphisa kwixesha elizayo, ukudityaniswa kwe-chiplet kunye nokupakishwa okuphambili kuya kuba sisisombululo esaphula uMthetho kaMoore.
Umzi-mveliso obambeleyo, “ongowona mandla” woyilo loqhagamshelo, ukwenziwa kunye nokupakishwa okuphezulu, ngokucacileyo uneengenelo zendalo kunye nezixhobo ezinokuvuselelwa.Ukuqaphela lo mkhwa, abadlali abaphezulu, njenge-TSMC, i-Samsung kunye ne-Intel, bagxile kwisakhiwo.
Ngokombono womntu ophezulu kwishishini le-semiconductor ye-OEM, inqanaba le-OEM yinkqubo engenakuphepheka kwixesha elizayo, elilingana nokwandiswa kwemodi ye-IDM ye-pan, efana ne-CIDM, kodwa umahluko kukuba i-CIDM yinto eqhelekileyo iinkampani ezahlukeneyo ukudibanisa, ngelixa pan IDM kukudibanisa imisebenzi eyahlukeneyo ukubonelela abathengi nge TurnkeySolution.
Kudliwanondlebe kunye neMicronet, i-Intel yathi ukusuka kwiinkqubo ezine zenkxaso yenqanaba le-OEM, i-Intel inokuqokelela itekhnoloji enenzuzo.
Kwinqanaba lokwenziwa kwe-wafer, i-Intel iphuhlise ubugcisa obutsha obufana ne-RibbonFET transistor architecture kunye nobonelelo lwamandla e-PowerVia, kwaye ngokuthe ngcembe iphumeza isicwangciso sokukhuthaza iinkqubo ezintlanu kwisithuba seminyaka emine.I-Intel inokubonelela ngobuchwephesha bokupakisha obuphambili obunje nge-EMIB kunye neFoveros ukunceda amashishini oyilo lwe-chip adibanise iinjini ezahlukeneyo zekhompyuter kunye nobuchwepheshe benkqubo.Amacandelo angundoqo emodyuli abonelela ngokuguquguquka okukhulu kuyilo kunye nokuqhuba ishishini lonke ukuba livelise izinto ezintsha kwixabiso, ukusebenza kunye nokusetyenziswa kwamandla.I-Intel izibophelele ekwakheni umfelandawonye we-UCIe ukunceda ii-cores ezivela kubaboneleli abahlukeneyo okanye iinkqubo ezahlukeneyo zisebenza kunye ngcono.Ngokumalunga nesoftware, izixhobo zesoftware ye-Intel evulekileyo ye-OpenVINO kunye ne-oneAPI inokukhawulezisa ukuhanjiswa kwemveliso kwaye yenza ukuba abathengi bavavanye izisombululo ngaphambi kokuveliswa.
Ngabane "abakhuseli" benqanaba le-OEM yenkqubo, i-Intel ilindele ukuba i-transistors edibeneyo kwi-chip enye iya kwanda kakhulu ukusuka kwi-100 yeebhiliyoni zangoku ukuya kwinqanaba le-trillion, eyona nto igqitywe ngaphambili.
"Inokubonwa ukuba inkqubo ye-Intel yenqanaba le-OEM injongo ihambelana nesicwangciso se-IDM2.0, kwaye inamandla amakhulu, eya kubeka isiseko sophuhliso lwexesha elizayo lwe-Intel."Aba bantu bangasentla bavakalise ngakumbi ithemba labo kwi-Intel.
ILenovo, edume “ngesisombululo setshiphu enye”, kunye nenqanaba lenkqubo ye-OEM entsha “yesitophu esinye”, inokungenisa utshintsho olutsha kwimarike yeOEM.
Iitshiphusi eziphumeleleyo
Enyanisweni, i-Intel yenze amalungiselelo amaninzi kwinqanaba le-OEM.Ukongeza kwiibhonasi ezahlukeneyo ezikhankanywe ngasentla, kufuneka kwakhona sibone iinzame kunye neenzame zokudibanisa ezenziwe kwi-paradigm entsha ye-system level encapsulation.
U-Chen Qi, umntu kwishishini le-semiconductor, uhlalutye ukuba kwi-resource reserve ekhoyo, i-Intel ine-IP epheleleyo ye-x86 ye-architecture, eyona nto ibalulekileyo.Kwangaxeshanye, i-Intel ine-IP yesantya esiphezulu se-SerDes yojongano lwe-IP efana ne-PCIe kunye ne-UCle, enokusetyenziswa ukudibanisa ngcono kunye nokudibanisa ngokuthe ngqo i-chiplets kunye ne-Intel core CPUs.Ukongeza, i-Intel ilawula ukuqulunqwa kwemigangatho ye-PCIe Technology Alliance, kunye ne-CXL Alliance kunye nemigangatho ye-UCle ephuhliswe kwisiseko se-PCIe nayo ikhokelwa yi-Intel, elingana ne-Intel mastering zombini i-IP engundoqo kunye neyona nto iphezulu kakhulu. -Speed SerDes iteknoloji kunye nemigangatho.
“Itekhnoloji yokupakisha exutyiweyo ye-Intel kunye nobuchule benkqubo ephucukileyo abubuthathaka.Ukuba inokudityaniswa ne-x86IP engundoqo kunye ne-UCIe, iya kuba nezixhobo ezininzi kunye nelizwi kwinqanaba le-OEM yenkqubo, kwaye yenze i-Intel entsha, eya kuhlala yomelele. "U-Chen Qi uxelele iJiwei.com.
Kuya kufuneka wazi ukuba ezi zizo zonke izakhono ze-Intel, ezingayi kuboniswa lula ngaphambili.
"Ngenxa yesikhundla sayo esomeleleyo kwintsimi ye-CPU kwixesha elidlulileyo, i-Intel yayilawula ngokuqinileyo isixhobo esibalulekileyo kwinkqubo - izixhobo zememori.Ukuba ezinye iitshiphusi kwinkqubo zifuna ukusebenzisa izixhobo zememori, kufuneka zizifumane ngeCPU.Ke ngoko, i-Intel inokuthintela iitshiphusi zezinye iinkampani ngale ntshukumo.Ngaphambili, ishishini belikhalazela le 'monopoly' engangqalanga.U-Chen Qi ucacisile, “Kodwa ngokukhula kwamaxesha, i-Intel yaziva uxinzelelo lokhuphiswano macala onke, ngoko yathatha inyathelo lokuqala lokutshintsha, ukuvula itekhnoloji yePCIe, kwaye yaseka iCXL Alliance kunye ne-UCle Alliance ngokulandelelana, elilingana nenkuthalo. ebeka ikeyiki etafileni.”
Ngokwembono yoshishino, itekhnoloji ye-Intel kunye noyilo kuyilo lwe-IC kunye nokupakishwa okuphambili kuseluqilima kakhulu.Uphando lukaIsaya lukholelwa ukuba intshukumo ye-Intel ukuya kwinqanaba lenkqubo ye-OEM kukudibanisa iingenelo kunye nezixhobo zale miba mibini kwaye yahlule ezinye ii-wafer foundries ngombono wenkqubo yokumisa enye ukusuka kuyilo ukuya ekupakishweni, ukuze ufumane imiyalelo engaphezulu imarike OEM elizayo.
Ngale ndlela, isisombululo se-Turnkey sinomtsalane kakhulu kwiinkampani ezincinci ezinophuhliso oluphambili kunye nezixhobo ezingonelanga ze-R&D.Uphando lukaIsaya lukwanethemba malunga nokutsalwa kwentshukumo ye-Intel kubathengi abancinci nabaphakathi.
Kubathengi abakhulu, ezinye iingcali zeshishini zatsho ngokungafihlisiyo ukuba eyona nto iluncedo ye-Intel yenqanaba le-OEM kukuba inokwandisa intsebenziswano yokuphumelela kunye nabanye abathengi beziko ledatha, abanjengoGoogle, iAmazon, njl.
"Okokuqala, i-Intel ingabagunyazisa ukuba basebenzise i-CPU IP ye-Intel X86 yoyilo kwiitshiphusi zabo ze-HPC, ezinceda ukugcina isabelo semarike ye-Intel kwintsimi ye-CPU.Okwesibini, i-Intel inokubonelela nge-high-speed interface protocol IP efana ne-UCle, ekulungele ngakumbi ukuba abathengi badibanise enye i-IP esebenzayo.Okwesithathu, i-Intel inikezela ngeqonga elipheleleyo lokusombulula iingxaki zokusasaza kunye nokupakishwa, ukwenza i-Amazon version ye-chiplet yesisombululo se-chiplet ukuba i-Intel ekugqibeleni iya kuthatha inxaxheba kuyo Kufuneka ibe yisicwangciso soshishino esigqibeleleyo.” Ezi ngcali zingasentla zongezelela.
Kusafuneka wenze izifundo
Nangona kunjalo, i-OEM idinga ukubonelela ngepakethi yezixhobo zophuhliso lweqonga kunye nokuseka ingcamango yenkonzo "yomthengi kuqala".Ukususela kwimbali yangaphambili ye-Intel, iphinde yazama i-OEM, kodwa iziphumo azonelisi.Nangona i-OEM yenqanaba lenkqubo inokubanceda baqonde iminqweno ye-IDM2.0, imingeni efihliweyo isafuna ukunqotshwa.
“Njengokuba iRoma ingakhiwanga ngosuku, iOEM kunye nokupakishwa akuthethi ukuba yonke into ilungile ukuba itekhnoloji yomelele.Kwi-Intel, owona mceli mngeni mkhulu kuseyinkcubeko ye-OEM.U-Chen Qi uxelele iJiwei.com.
U-Chen Qijin waphinda wabonisa ukuba ukuba i-Intel ye-ecological, efana nemveliso kunye nesofthiwe, ingasombululwa ngokuchitha imali, ukuhanjiswa kwetekhnoloji okanye imowudi yeqonga evulekileyo, umngeni omkhulu we-Intel kukwakha inkcubeko ye-OEM kwinkqubo, ukufunda ukunxibelelana nabathengi. , ukubonelela abathengi ngeenkonzo abazidingayo, kwaye bahlangabezane neemfuno zabo ze-OEM ezahlukeneyo.
Ngokutsho kophando lukaIsaya, ekuphela kwento i-Intel efuna ukongeza kubuchule be-wafer foundry.Xa kuthelekiswa ne-TSMC, enabathengi abakhulu abaqhubekayo kwaye bezinzile kunye neemveliso zokunceda ukuphucula isivuno senkqubo nganye, i-Intel ubukhulu becala ivelisa imveliso yayo.Kwimeko yeendidi zeemveliso ezinyiniweyo kunye nomthamo, isakhono se-Intel sokwenza iitshiphu silinganiselwe.Ngenqanaba lenkqubo ye-OEM imowudi, i-Intel inethuba lokutsala abanye abathengi ngoyilo, ukupakishwa okuphezulu, ukutya okuziinkozo kunye nobunye ubuchwepheshe, kunye nokuphucula amandla okwenza i-wafer inyathelo ngenyathelo ukusuka kwinani elincinci leemveliso ezahlukeneyo.
Ukongeza, njenge "password yetrafikhi" yenqanaba le-OEM yenkqubo, ukuPakisha okuPhezulu kunye neChiplet nazo zijongene nobunzima bazo.
Ukuthatha ukupakishwa kwenqanaba lenkqubo njengomzekelo, kwintsingiselo yayo, ilingana nokuhlanganiswa kwee-Dies ezahlukeneyo emva kokuveliswa kwe-wafer, kodwa akulula.Ukuthatha i-TSMC njengomzekelo, ukusuka kwisisombululo sokuqala se-Apple ukuya kwi-OEM yamva ye-AMD, i-TSMC ichithe iminyaka emininzi kubuchwephesha bokupakisha obuphambili kwaye yazisa amaqonga amaninzi, anje ngeCoWoS, SoIC, njl., kodwa ekugqibeleni uninzi lwazo. isabonelela ngeperi ethile yeenkonzo zokupakisha zamaziko, ayisosisombululo esisebenzayo sokupakisha esinamarhe okubonelela abathengi nge "chips ezifana neebhloko zokwakha".
Ekugqibeleni, i-TSMC yasungula iqonga le-3D Fabric OEM emva kokudibanisa iitekhnoloji ezahlukeneyo zokupakisha.Ngelo xesha, i-TSMC ibambe ithuba lokuthatha inxaxheba ekubunjweni kwe-UCle Alliance, kwaye yazama ukudibanisa imigangatho yayo kunye nemigangatho ye-UCIe, ekulindeleke ukuba ikhuthaze "iibhloko zokwakha" kwixesha elizayo.
Isitshixo sokudibanisa i-core particle kukudibanisa "ulwimi", oko kukuthi, ukulinganisa i-chiplet interface.Ngesi sizathu, i-Intel iphinde yasebenzisa ibhanile yempembelelo ukuseka umgangatho we-UCIE we-chip ukuya kuqhagamshelo lwe-chip olusekwe kumgangatho wePCIe.
Ngokucacileyo, isafuna ixesha "lokucocwa kwezithethe".U-Linley Gwennap, umongameli kunye nomhlalutyi oyintloko we-Linley Group, wabeka phambili udliwano-ndlebe kunye neMicronet ukuba eyona nto ifunwa yi-shishini yindlela eqhelekileyo yokudibanisa ama-cores kunye, kodwa iinkampani zifuna ixesha lokuyila ii-cores ezintsha ukuhlangabezana nemigangatho ekhulayo.Nangona kukho inkqubela eyenziweyo, kusathatha iminyaka emi-2-3.
Umntu ophezulu we-semiconductor uvakalise amathandabuzo kwimbono ye-multi-dimensional.Kuya kuthatha ixesha ukujonga ukuba i-Intel iya kwamkelwa yintengiso kwakhona emva kokurhoxiswa kwayo kwinkonzo ye-OEM ngo-2019 kunye nokubuya kwayo ngaphantsi kweminyaka emithathu.Ngokwethekhinoloji, i-CPU yesizukulwana esilandelayo ekulindeleke ukuba isungulwe yi-Intel ngo-2023 kusenzima ukubonisa inzuzo ngokwenkqubo, umthamo wokugcina, imisebenzi ye-I / O, njl. kwixesha elidlulileyo, kodwa ngoku kufuneka liqhube uhlengahlengiso lombutho, ukuphuculwa kweteknoloji, ukhuphiswano lweemarike, ukwakhiwa kwefektri kunye neminye imisebenzi enzima ngexesha elifanayo, elibonakala lidibanisa imingcipheko engaziwayo kunemingeni yobugcisa edlulileyo.Ngokukodwa, ingaba i-Intel inokuseka inqanaba lenkqubo entsha ye-OEM yokubonelela ngexesha elifutshane kwakhona luvavanyo olukhulu.
Ixesha lokuposa: Oct-25-2022